Empack 2017

  • Steensma Franeker Bolidtop 700

    Empack

Empack

Stand no. G111

The only packaging show in the Benelux which offers a gleam into the future of packaging. Bolidt will present its flooring systems that meet all requirements in this industry due to their unique concepts in composition, optics and functionality.

Empack 2017

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CONTACT INFORMATION

Bolidt Synthetic Products & Systems

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Mailing address

P.O. Box 131
3340 AC Hendrik-Ido-Ambacht
The Netherlands

Visitor address

Bolidt Innovation Center
Noordeinde 2
Hendrik-Ido-Ambacht
3341 LW The Netherlands

TEL +31 (0)78 684 54 44
EMAIL website@bolidt.nl